Protocol for high-throughput single-cell patterning using a reusable ultrathin metal microstencil

使用可重复使用的超薄金属微模板进行高通量单细胞图案化的协议

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作者:Qingqing Tian, Kunming Xing, Yongshu Liu, Qian Wang, Haonan Sun, Ying-Nan Sun, Shusheng Zhang

Abstract

Exploiting convenient strategies for single-cell preparation while maintaining a high throughput remains challenging. This protocol describes a simple workflow for high-throughput single-cell patterning using a reusable ultrathin metal microstencil (UTmS). We describe UTmS-chip design, fabrication, and quality characterization. We then detail the preparation of flat substrates and chip assembly for single-cell patterning, followed by culturing of cells on a chip. Finally, we describe the evaluation of single-cell patterning and the downstream applications for studying single-cell calcium release and apoptosis. For complete details on the use and execution of this protocol, please refer to Song et al. (2021).1.

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