Surface engineering of high- k polymeric dielectric layers with a fluorinated organic crosslinker for use in flexible-platform electronics

利用氟化有机交联剂对高 k 聚合物介电层进行表面工程设计,以用于柔性平台电子器件

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作者:Heqing Ye, Hyeok-Jin Kwon, Ka Yeon Ryu, Kaibin Wu, Jeongwan Park, Giri Babita, Inae Kim, Chanwoo Yang, Hoyoul Kong, Se Hyun Kim

Abstract

High-k polymeric layers were prepared by combining various functional groups and were applied as gate dielectrics for practical organic field-effect transistors (OFETs). Crosslinking of the polymeric layers through UV-assisted organic azide fluorine-based crosslinkers induced dramatic improvements in the electrical performance of the OFET, such as field-effect mobility and bias-stress stability. Our synthesis and manufacturing method can be a useful technique for ensuring device operation stability and electrical property enhancement. With this analysis, we further applied our polymer-dielectric OFETs to flexible-platform-based electronic components, including unit OFETs and simple logic devices (NOT, NAND, and NOR gates). The outcomes of this research and development suggest a suitable method for the low-cost mass production of large-area flexible and printable devices, using a printing-based approach to replace current processes.

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